Translation and analysis of words by ChatGPT artificial intelligence
On this page you can get a detailed analysis of a word or phrase, produced by the best artificial intelligence technology to date:
- how the word is used
- frequency of use
- it is used more often in oral or written speech
- word translation options
- usage examples (several phrases with translation)
- etymology
What (who) is Small Outline J - definition
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![TSOP type I: [[Atmel]] AT29C010A](https://commons.wikimedia.org/wiki/Special:FilePath/IBM PCMCIA Data-Fax Modem V.34 FRU 42H4326 - Atmel AT29C010A-9352.jpg?width=200 "TSOP type I: [[Atmel]] AT29C010A")
![[[Micrograph]] of the small intestine [[mucosa]] showing the [[intestinal villi]] and [[crypts of Lieberkühn]].](https://commons.wikimedia.org/wiki/Special:FilePath/Small intestine low mag.jpg?width=200 "[[Micrograph]] of the small intestine [[mucosa]] showing the [[intestinal villi]] and [[crypts of Lieberkühn]].")
![Fig 400]]](https://commons.wikimedia.org/wiki/Special:FilePath/Sobo 1906 401.png?width=200 "Fig 400]]")
![Small intestine [[in situ]], greater omentum folded upwards.](https://commons.wikimedia.org/wiki/Special:FilePath/Sobo 1906 408.png?width=200 "Small intestine [[in situ]], greater omentum folded upwards.")
.jpg?width=200 "Tissue layers (mucosa, submucosa & muscularis)")
Wikipedia
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Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.
TSOP is the smallest leaded form factor for flash memory.
